Project Description
I need an experienced hardware engineer to take my concept for an ultra-compact tracker and turn it into a manufacturable 4-layer PCB that measures no more than 22 × 22 mm. The core functionality is location tracking, so LTE-M / NB-IoT with embedded eSIM support for Jio / Airtel and a GNSS solution that delivers standard 5–10 m accuracy are required. The device must perform reliably both indoors and outdoors.
Key elements you will integrate:
• Cellular: LTE-M / NB-IoT modem with eSIM footprint pre-provisioned for Indian networks.
• Positioning: GNSS (GPS + GLONASS) with a chip or flex PCB antenna that fits the size envelope.
• Sensing: MEMS microphone capable of local audio recording to at least 128 MB on-board flash, plus an accelerometer for motion events.
• User input: Single, double, and triple-press button detection implemented in hardware with clean debounce.
• Power: Li-Po management, magnetic charging pads, and a deep-sleep regime that delivers weeks of standby and hours of active use.
• Mechanical: All components placed and routed on a 4-layer board optimised for RF, audio, and power integrity.
Deliverables
1. Schematic, BOM, and part footprints.
2. RF-aware PCB layout (Gerber, ODB++, IPC-2581).
3. Embedded reference firmware showing cellular attach, GNSS fix, button press events, microphone capture, and low-power transitions.
4. Power budget and expected lifetime calculations.
5. Design validation report covering RF performance, GNSS sensitivity, and deep-sleep current.
I prefer Altium or KiCad source files and well-commented C/C++ code (Zephyr RTOS or bare-metal are both fine). If you have previous experience squeezing RF, GNSS, audio, and battery management into a postage-stamp-sized board, I’d love to review those references.