Project Description
The core of the board is already in place: I have routed the ESP32-S3, its power stages, and footprints for a set of temperature sensors along with the basic peripherals. What remains is to turn this halfway-finished layout into a manufacture-ready design that cleanly captures sensor data, meets good signal-integrity practice, and is easy to assemble.
Here is where the project stands:
• Schematic up to date for the ESP32-S3, LDOs, USB-to-UART bridge, and four digital temperature sensors
• Initial two-layer stack-up with partial ground pour and power planes
• Footprints placed, but routing has not been done yet.
• No final BOM, manufacturing drawings,
What I need from you:
1. Review and refine the schematic to be sure every net required for clean sensor data acquisition is present and correctly decoupled.
2. Finish the PCB layout: optimise component placement, complete all routing, add proper pours, test points, and silkscreen.
3. Generate the full manufacturing package—Gerbers, drill files, pick-and-place, assembly notes, and a clean BOM.
4. Supply a minimal ESP-IDF project that confirms the board boots, enumerates the temperature sensors, and streams their readings over USB or Wi-Fi.
Tooling: the current files are in KiCad 10; please stick with KiCad, documenting any library changes.
Acceptance criteria
• DRC and ERC pass with zero errors or warnings.
• USB trace pair within ±10 % of 90 Ω differential impedance (document your calculation).
• Board brings up first time with sensor data visible in a serial console demo.
If this scope feels clear, let me know your typical turnaround for a board of this size and we can dive straight into the files.